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Advances in Cryogenic Engineering

Advances in Cryogenic Engineering 24

Edited by K. Timmerhaus
Format: Paperback / softback
Publisher: Springer-Verlag New York Inc., New York, NY, United States
Published: 19th May 2013
Dimensions: w 170mm h 244mm d 31mm
Weight: 944g
ISBN-10: 146139855X
ISBN-13: 9781461398554
Barcode No: 9781461398554
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Synopsis
The Second International Cryogenic Materials Conference (ICMC) was held in Boulder, Colorado, in conjunction with the 1977 Cryogenic Engineering Con ference (CEC). Special thanks must be given to the University of Colorado for their skillful hosting of these two conferences. Collaboration between the two con ferences has been mutually beneficial, providing the materials special ist with insight into new applications and design concepts and the cryogenic engineer with exposure to modern materials accomplishments and potentials. The Proceedings of the 1977 Cryogenic Engineering Conference are published in Volume 23 of Advances in Cryogenic Engineering. Both conferences will be held again simul taneously in Madison, Wisconsin, in August 1979. The success and growth of the two International Cryogenic Materials Con ferences have led to the formation of an ICMC Board of Directors. The board members will serve a four-year term and include: Chairman, R. P. Reed (U.S.), R. W. Boom (U.S.), A. F. Clark (U.S.), G. Hartwig (W. Germany), J. W. Morris (U.S.), M. Suenaga (U.S.), K. Tachikawa (Japan), J. Tanaka (Japan), and K. A. Yushchenko (USSR).

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