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Materials for Advanced Packaging

Edited by C.P. Wong, Daniel Lu
Format: Hardback
Publisher: Springer International Publishing AG, Cham, Switzerland
Published: 30th Dec 2016
Dimensions: w 156mm h 234mm d 51mm
Weight: 1547g
ISBN-10: 3319450972
ISBN-13: 9783319450971
Barcode No: 9783319450971
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Synopsis
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

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