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Three-Dimensional Integration of Semiconductors

Processing, Materials, and Applications

Format: Paperback / softback
Publisher: Springer International Publishing AG, Cham, Switzerland
Published: 28th Mar 2019
Dimensions: w 156mm h 234mm d 22mm
Weight: 601g
ISBN-10: 3319792555
ISBN-13: 9783319792552
Barcode No: 9783319792552
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Synopsis
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

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