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Micro Electronic Packing Technology

Materials and Processes

Edited by W.T. Shieh
Format: Hardback
Publisher: ASM International, Ohio, United States
Published: 30th Nov 1989
Dimensions: h 230mm
ISBN-10: 0871703599
ISBN-13: 9780871703590
Barcode No: 9780871703590
Synopsis
Proceedings of the Second ASM International Electronics and Processing Congress held in Philadelphia, April 1989. More than 50 contributions present the recent microelectronic R&D and engineering efforts toward higher density and higher speed electronic packaging methodologies and fabrication techno

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