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Multichip Module Design, Fabrication and Testing

McGraw-Hill's Electronic Packaging & Interconnection S.

By (author) James J. Licari
Format: Hardback
Publisher: McGraw-Hill Education - Europe, New York, United States
Imprint: McGraw-Hill Inc.,US
Published: 1st Oct 1994
Dimensions: w 157mm h 229mm d 28mm
Weight: 704g
ISBN-10: 0070377154
ISBN-13: 9780070377158
Barcode No: 9780070377158
Synopsis
The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested and manufactured. This evolving technology for packaging printed circuit boards (PCBs) is commanding both interest and excitement. This work describes MCM technology, as well as showing designers how to use it in practice. The guide covers practical issues such as electrical testing, rework procedures and failure modes and mechanisms.

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