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The Art and Science of Microsystem Packaging

Preliminary Entry No. 201. Microsystems

By (author) Leland Spangler
Genres: Microprocessors
Format: Hardback
Publisher: Springer-Verlag New York Inc., New York, NY, United States
Published: 31st Mar 2007
ISBN-10: 0387489045
ISBN-13: 9780387489049
Barcode No: 9780387489049
Synopsis
"The Art and Science of Microsystem Packaging" is written for microsystem, MEMS and microfabrication engineers who are designing microsystem packages or systems that use microsystem package technology. This book is a reference for practicing engineers, both industrial and academic, who are designing either micromachined products or products that contain micromachined devices. Emphasis is placed on materials, technologies and assembly processes and guidelines that are either being used in production today, are production worthy, or have a good chance of being developed to a level needed to package a saleable product. The reader is assumed to have general understanding of micromachined concepts and semiconductor fabrication technology.

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